waveguide_width
float32
0.5
2
waveguide_height
float32
200
600
cladding_material
stringclasses
3 values
cladding_thickness
float32
1
5
deposition_method
stringclasses
3 values
etch_method
stringclasses
3 values
sidewall_roughness
float32
0.5
5
annealing_params
stringclasses
4 values
wavelength
float32
1.5k
1.6k
polarization
stringclasses
2 values
input_power
float32
-10
10
temperature
float32
20
80
bend_radius
float32
20
200
device_length
float32
1
50
insertion_loss
float32
0.53
26.5
propagation_loss
float32
0.1
5
coupling_efficiency_input
float32
40
90
coupling_efficiency_output
float32
40
90
scattering_loss
float32
0.01
0.5
effective_index
float32
1.5
2
mode_confinement_factor
float32
0.7
0.95
batch_id
stringclasses
50 values
data_source
stringclasses
2 values
measurement_method
stringclasses
4 values
uncertainty
float32
0.01
0.2
0.995
232.270004
SiO2
4.43
Sputtering
Wet Etch
1.55
1000C_1hr
1,543.119995
TM
-6.01
31.23
90.870003
33.369999
3.901
0.887
75.639999
50.650002
0.068
1.804
0.91
BATCH_29
Synthetic
OTDR
0.139
0.632
268.769989
Polymer
3.22
PECVD
RIE
4.4
No_Anneal
1,500.130005
TE
-7.25
76.379997
185.889999
33.509998
5.759
1.159
73.860001
71.889999
0.267
1.542
0.745
BATCH_20
Measurement
OTDR
0.069
1.606
244.309998
SiO2
3.77
PECVD
ICP
2.81
900C_1hr
1,561.670044
TE
-3.86
25.719999
93.239998
5.82
2.003
0.217
63.959999
42.779999
0.274
1.926
0.738
BATCH_18
Measurement
microring_Q
0.039
1.329
376.859985
Polymer
3.42
PECVD
ICP
0.84
900C_1hr
1,579.75
TM
-3.77
30.41
113.919998
23.41
7.271
2.527
57.439999
71.099998
0.073
1.661
0.885
BATCH_25
Synthetic
ring_resonance
0.081
1.346
500.26001
Polymer
3.19
PECVD
Wet Etch
2.45
No_Anneal
1,513.72998
TE
-5.95
56.939999
21.52
46.66
15.061
2.807
52.43
69.07
0.242
1.596
0.724
BATCH_19
Measurement
microring_Q
0.112
1.843
312.459991
Polymer
2.44
Sputtering
Wet Etch
2.37
1000C_1hr
1,514.900024
TM
-7.66
54.189999
76.690002
11.4
4.975
3.836
69.620003
86.610001
0.412
1.748
0.745
BATCH_18
Measurement
cut-back
0.02
1.239
237.389999
Polymer
2.4
Sputtering
RIE
3.48
900C_1hr
1,520.329956
TE
-5.82
35.759998
51.16
26.35
6.675
2.217
74.519997
63.939999
0.395
1.861
0.796
BATCH_29
Synthetic
cut-back
0.042
1.402
510.140015
SiO2
1.89
LPCVD
RIE
0.79
1000C_1hr
1,507.98999
TE
-5.1
69.010002
128.110001
13.84
6.787
4.465
64.440002
75.050003
0.09
1.849
0.82
BATCH_23
Measurement
ring_resonance
0.064
1.393
369.450012
Air
3.97
LPCVD
Wet Etch
0.91
900C_1hr
1,546.199951
TE
-3.17
35.150002
142.279999
49.34
20.49
3.876
45.610001
69.110001
0.017
1.589
0.766
BATCH_20
Measurement
ring_resonance
0.098
0.975
485.440002
Air
2.26
Sputtering
ICP
1.48
No_Anneal
1,538.660034
TE
-3.85
54.860001
155.809998
25.42
4.028
1.214
41.950001
72.910004
0.294
1.873
0.708
BATCH_19
Measurement
microring_Q
0.081
0.759
370.140015
Air
3.49
PECVD
Wet Etch
3.17
1000C_1hr
1,580.060059
TE
2.36
23.84
94.709999
21.129999
3.708
1.146
88.190002
83.269997
0.387
1.929
0.932
BATCH_34
Measurement
OTDR
0.099
1.219
337.429993
SiO2
3.52
PECVD
Wet Etch
4.41
1000C_1hr
1,584.73999
TM
4.49
39.209999
28.98
32.290001
12.764
3.347
55.619999
43.349998
0.379
1.612
0.92
BATCH_48
Synthetic
ring_resonance
0.16
1.41
418.630005
Polymer
3
LPCVD
ICP
3.96
900C_1hr
1,544.680054
TM
-5.91
56.849998
181.070007
14.96
2.55
0.375
75.519997
71.389999
0.423
1.613
0.722
BATCH_30
Synthetic
cut-back
0.12
1.966
374.380005
SiO2
4.96
PECVD
Wet Etch
2.34
No_Anneal
1,542.819946
TE
-0.65
78.239998
127.389999
28.610001
13.058
3.902
77.709999
63.66
0.228
1.9
0.841
BATCH_35
Measurement
OTDR
0.198
1.894
494.690002
SiO2
4.64
PECVD
Wet Etch
4.8
900C_3hr
1,582.420044
TM
-6.83
56.279999
95.790001
16.690001
3.984
1.201
89.739998
72.059998
0.108
1.589
0.826
BATCH_4
Synthetic
cut-back
0.163
0.903
361.25
SiO2
1.16
LPCVD
ICP
1.56
No_Anneal
1,535.5
TE
2.68
21.040001
111.339996
2.33
2.763
4.471
86.769997
80.150002
0.087
1.782
0.841
BATCH_41
Synthetic
cut-back
0.103
1.726
523.849976
SiO2
4.96
Sputtering
RIE
4.74
1000C_1hr
1,551.689941
TE
-7.52
50.540001
38.73
21.26
2.482
0.341
84.5
62.32
0.291
1.906
0.855
BATCH_34
Measurement
microring_Q
0.102
0.581
498.660004
Polymer
3.19
PECVD
Wet Etch
2.62
1000C_1hr
1,532.189941
TM
9.95
56.060001
146.179993
46.810001
17.433001
3.457
62.560001
66.709999
0.148
1.88
0.809
BATCH_46
Measurement
cut-back
0.031
1.623
403.75
Air
2.38
LPCVD
Wet Etch
1.98
900C_3hr
1,507.619995
TE
5.99
46.650002
136.25
34.459999
15.643
4.222
48.279999
69.470001
0.135
1.549
0.864
BATCH_39
Synthetic
ring_resonance
0.199
0.54
284.720001
SiO2
1.01
LPCVD
Wet Etch
4.08
1000C_1hr
1,588.310059
TE
8.34
21.860001
42.57
5.54
3.858
4.998
54.07
78.199997
0.261
1.784
0.829
BATCH_8
Synthetic
cut-back
0.088
1.342
310.940002
Air
2.65
PECVD
ICP
2.26
900C_1hr
1,544.469971
TE
-8.4
58.23
99.629997
38.34
18.267
4.315
80.949997
55.32
0.219
1.513
0.905
BATCH_35
Measurement
ring_resonance
0.09
1.702
481.640015
Air
4.09
LPCVD
ICP
2.52
900C_3hr
1,551.819946
TE
-9.5
45.91
118.940002
40.540001
3.077
0.558
75.449997
43.41
0.473
1.989
0.941
BATCH_21
Measurement
ring_resonance
0.048
1.575
577.25
SiO2
1.12
PECVD
RIE
2.65
No_Anneal
1,595.319946
TM
-7.89
30.969999
54.529999
41.290001
21.125999
4.853
68.949997
85.07
0.324
1.564
0.906
BATCH_37
Measurement
microring_Q
0.086
0.958
545.849976
SiO2
1.48
Sputtering
Wet Etch
0.84
No_Anneal
1,564.209961
TM
5.72
79.470001
97.480003
17.959999
9.209
4.08
65.580002
69.32
0.096
1.818
0.745
BATCH_30
Synthetic
cut-back
0.076
1.633
471.690002
Air
2.78
LPCVD
ICP
3.39
No_Anneal
1,574.01001
TE
-1.52
39.810001
135.580002
17.309999
8.626
4.018
45.369999
79.599998
0.401
1.707
0.797
BATCH_29
Measurement
microring_Q
0.141
1.511
222.220001
Air
1.39
Sputtering
Wet Etch
3.29
1000C_1hr
1,588.369995
TM
1.8
67.599998
49.709999
8.17
4.477
4.475
41.290001
77.93
0.479
1.832
0.764
BATCH_25
Synthetic
OTDR
0.029
1.578
293.619995
SiO2
2.63
LPCVD
RIE
4.14
No_Anneal
1,552.329956
TE
5.24
36.209999
163.259995
44.369999
10.209
2.104
62.689999
55.810001
0.208
1.896
0.772
BATCH_16
Measurement
ring_resonance
0.142
1.745
255.570007
SiO2
2.33
LPCVD
ICP
0.5
No_Anneal
1,570.22998
TE
-3.16
33.25
63.299999
41.919998
15.8
3.39
40.52
73.839996
0.256
1.896
0.818
BATCH_35
Measurement
cut-back
0.04
0.619
573.51001
Air
1.45
LPCVD
RIE
4.8
No_Anneal
1,512.040039
TM
-7.33
76.019997
61.810001
21.93
8.806
3.494
69.779999
60
0.334
1.954
0.82
BATCH_32
Synthetic
microring_Q
0.075
1.475
394.799988
Polymer
2.15
LPCVD
Wet Etch
3.14
900C_3hr
1,548.329956
TE
0.89
60.330002
165.059998
17.98
6.577
2.819
51.669998
44.68
0.201
1.825
0.899
BATCH_31
Measurement
cut-back
0.112
1.195
415.140015
SiO2
3.31
PECVD
RIE
2.38
No_Anneal
1,529.209961
TM
-8.58
53.900002
155.589996
37.43
3.814
0.49
45.060001
66.540001
0.266
1.766
0.909
BATCH_44
Synthetic
cut-back
0.195
1.484
344.829987
SiO2
2.73
LPCVD
Wet Etch
0.93
900C_3hr
1,523.880005
TM
-3.52
51.75
195.240005
49.650002
11.535
1.987
63.349998
77.57
0.126
1.727
0.831
BATCH_19
Synthetic
microring_Q
0.108
1.005
295.079987
SiO2
2.57
LPCVD
Wet Etch
1.21
900C_3hr
1,522.599976
TE
7.36
30.799999
91.230003
27.190001
11.769
4.038
84.599998
62.900002
0.097
1.572
0.715
BATCH_43
Synthetic
microring_Q
0.114
1.736
201.589996
Polymer
2.86
Sputtering
Wet Etch
4.37
900C_3hr
1,504.660034
TM
9.75
31.940001
194.580002
46.400002
20.875
4.098
87.800003
57.630001
0.234
1.598
0.928
BATCH_37
Measurement
ring_resonance
0.03
0.595
211.009995
Air
2.69
PECVD
ICP
4.57
900C_1hr
1,500.369995
TM
-5.8
78.209999
138.820007
26.65
7.98
2.732
45.73
73.540001
0.151
1.532
0.725
BATCH_39
Measurement
microring_Q
0.124
0.734
590.609985
SiO2
4.88
PECVD
Wet Etch
3.63
900C_3hr
1,529
TM
-0.55
71.82
65.139999
31.49
16.971001
4.829
61.990002
40.720001
0.314
1.585
0.921
BATCH_27
Measurement
ring_resonance
0.163
0.829
275.440002
SiO2
4.61
LPCVD
Wet Etch
2.58
1000C_1hr
1,552.119995
TM
-0.62
33.080002
130.5
13.49
2.287
0.329
76.529999
56.860001
0.486
1.735
0.938
BATCH_45
Measurement
microring_Q
0.023
1.175
205.029999
Air
1.64
Sputtering
RIE
3.71
900C_1hr
1,541.719971
TM
1.25
74.400002
102.989998
48.630001
23.974001
4.756
75.169998
56.200001
0.318
1.818
0.829
BATCH_48
Synthetic
cut-back
0.192
0.865
245.979996
Air
3.87
LPCVD
RIE
4.94
900C_3hr
1,550.880005
TM
-9.45
76.18
119.25
14.15
3.6
1.487
58.389999
64.169998
0.477
1.598
0.804
BATCH_11
Measurement
cut-back
0.066
1.185
513.580017
Air
4.28
PECVD
Wet Etch
0.74
1000C_1hr
1,553.660034
TE
7.75
65.510002
194.699997
26.799999
10.243
3.616
73.720001
81.779999
0.105
1.916
0.703
BATCH_43
Measurement
microring_Q
0.02
1.836
280.589996
Air
1.22
LPCVD
ICP
1.49
900C_3hr
1,505.630005
TE
-1.28
55.43
63.720001
48.66
17.629999
3.243
87.019997
57.630001
0.06
1.706
0.719
BATCH_41
Measurement
cut-back
0.012
1.469
221.220001
Polymer
2.98
Sputtering
RIE
0.88
900C_1hr
1,559.680054
TM
5.6
57.029999
177.300003
25.98
11.227
3.873
49.599998
61.939999
0.361
1.996
0.778
BATCH_34
Synthetic
ring_resonance
0.133
1.162
545.97998
Polymer
3.71
PECVD
Wet Etch
3.59
900C_3hr
1,533.369995
TM
2.04
44.02
45.720001
2.18
2.177
3.301
86.959999
44.630001
0.317
1.505
0.837
BATCH_29
Measurement
microring_Q
0.07
0.51
357.950012
SiO2
2.58
PECVD
Wet Etch
2.84
1000C_1hr
1,520.319946
TE
4.35
63.939999
184.850006
33.860001
17.327999
4.86
70.279999
47.290001
0.344
1.869
0.728
BATCH_46
Measurement
cut-back
0.149
1.743
235.889999
SiO2
1.55
LPCVD
RIE
4.25
No_Anneal
1,540.619995
TM
-0.62
40.380001
77.669998
28.41
8.38
2.315
54.18
88.709999
0.451
1.93
0.831
BATCH_36
Measurement
ring_resonance
0.2
1.768
222.070007
Polymer
3.06
LPCVD
Wet Etch
1.97
900C_1hr
1,556.689941
TM
-9.64
23.85
142.610001
2.8
1.614
3.814
42.950001
68.230003
0.091
1.826
0.924
BATCH_26
Synthetic
OTDR
0.137
1.085
227.080002
SiO2
3.26
LPCVD
ICP
2.71
No_Anneal
1,559.030029
TE
-1.06
66.339996
91.660004
32.419998
12.696
3.415
46.23
45.84
0.261
1.617
0.795
BATCH_47
Synthetic
cut-back
0.191
1.351
351.559998
Polymer
3.04
PECVD
RIE
2.39
900C_1hr
1,584.040039
TE
3.51
24.1
109.989998
46.98
22.591
4.49
79.440002
76.919998
0.145
1.655
0.94
BATCH_22
Measurement
ring_resonance
0.059
0.973
394.630005
Polymer
1.1
Sputtering
ICP
3.01
No_Anneal
1,543.910034
TE
6.62
73.410004
38.200001
9.94
5.329
4.734
45
74.639999
0.16
1.813
0.742
BATCH_31
Measurement
OTDR
0.191
0.723
374.779999
SiO2
2.37
PECVD
Wet Etch
4.61
1000C_1hr
1,524.449951
TE
-3.84
22.059999
108.510002
49.439999
16.473
3.083
79.279999
81.870003
0.331
1.903
0.799
BATCH_24
Synthetic
cut-back
0.015
1.871
485.769989
SiO2
1.04
LPCVD
ICP
1.38
900C_3hr
1,585.02002
TM
5.68
26.18
60.459999
18.040001
1.057
0.304
54.5
52.040001
0.096
1.594
0.846
BATCH_20
Synthetic
microring_Q
0.082
0.651
449.459991
Polymer
4.16
LPCVD
ICP
1
900C_3hr
1,550.810059
TM
5.71
20.27
184.080002
41.950001
21.753
4.966
49.57
69.010002
0.167
1.531
0.9
BATCH_17
Measurement
OTDR
0.047
1.216
301.140015
Air
4.92
LPCVD
ICP
0.62
1000C_1hr
1,588.780029
TE
3.8
40.700001
141.919998
17.059999
8.879
4.534
79.160004
69.260002
0.318
1.616
0.766
BATCH_6
Measurement
cut-back
0.023
1.287
585.719971
Air
1.51
LPCVD
RIE
3.51
1000C_1hr
1,521.780029
TE
-0.23
67.150002
125.989998
20.219999
5.86
2.514
61.200001
88.400002
0.046
1.903
0.816
BATCH_38
Synthetic
ring_resonance
0.131
0.933
368.230011
Polymer
2.03
Sputtering
Wet Etch
2.66
900C_3hr
1,512.349976
TM
-4.86
22.42
89.419998
32.41
13.824
4.049
87.489998
77.339996
0.222
1.626
0.903
BATCH_49
Measurement
microring_Q
0.056
0.843
287.630005
SiO2
3.08
Sputtering
RIE
2.76
900C_1hr
1,534.5
TM
-8.39
28.110001
46.639999
38.959999
6.096
1.155
43.139999
89.639999
0.285
1.626
0.89
BATCH_7
Measurement
ring_resonance
0.045
1.737
482.850006
Polymer
3.85
PECVD
ICP
4.56
No_Anneal
1,563.650024
TE
7.2
46.790001
136.089996
35.290001
18.57
4.916
55.02
56.220001
0.146
1.657
0.725
BATCH_11
Synthetic
cut-back
0.192
1.639
201.490005
SiO2
2.67
PECVD
RIE
3.1
900C_1hr
1,515.099976
TE
-3.14
31.280001
38.740002
44.18
13.565
2.891
70.459999
44.740002
0.492
1.732
0.839
BATCH_37
Measurement
cut-back
0.082
1.754
242.710007
Air
2.18
PECVD
RIE
1.96
No_Anneal
1,590.650024
TE
-9.21
76.209999
75.529999
7.45
5.168
4.676
76.059998
72.529999
0.13
1.937
0.768
BATCH_38
Synthetic
cut-back
0.137
0.744
251.830002
SiO2
1.28
Sputtering
RIE
3.56
No_Anneal
1,595.47998
TM
1.08
61.98
53.380001
9.37
5.007
3.333
46.939999
87.150002
0.274
1.535
0.702
BATCH_18
Synthetic
cut-back
0.015
1.214
390.470001
Air
3.7
PECVD
Wet Etch
4.07
No_Anneal
1,506.310059
TE
-4.63
72.650002
64.93
18.07
4.238
1.26
44.240002
51.099998
0.353
1.998
0.743
BATCH_48
Measurement
cut-back
0.011
1.422
378.329987
SiO2
1.82
Sputtering
RIE
0.57
900C_1hr
1,586.48999
TE
2.12
61.459999
120.129997
10.32
6.901
4.926
72.889999
83.75
0.37
1.924
0.8
BATCH_30
Synthetic
OTDR
0.075
0.59
296.549988
Air
4.97
LPCVD
RIE
1.01
1000C_1hr
1,550.109985
TE
3.38
64.980003
93.330002
47.57
13.035
2.54
84.910004
79.709999
0.2
1.88
0.923
BATCH_3
Synthetic
microring_Q
0.177
1.712
502.089996
SiO2
1.15
Sputtering
Wet Etch
2.48
900C_3hr
1,509.300049
TM
3.08
47.380001
83.389999
11.86
7.355
4.896
86.400002
45.290001
0.114
1.968
0.844
BATCH_37
Synthetic
cut-back
0.114
1.585
490.329987
SiO2
4.93
PECVD
ICP
4.32
1000C_1hr
1,532.73999
TM
7.34
67.480003
168.960007
27.99
11.037
3.471
85.139999
68.339996
0.128
1.637
0.891
BATCH_43
Synthetic
OTDR
0.149
0.741
535.900024
Air
4.87
Sputtering
Wet Etch
1
1000C_1hr
1,566.670044
TM
2.57
28.459999
113.089996
23.23
9.416
3.215
51.5
81.860001
0.078
1.523
0.938
BATCH_15
Measurement
OTDR
0.189
0.934
453.459991
Air
4.82
Sputtering
RIE
1.32
900C_1hr
1,514.329956
TM
8.97
33.709999
86.940002
30.16
3.585
0.535
40.32
55.560001
0.364
1.922
0.818
BATCH_13
Synthetic
ring_resonance
0.116
0.959
283.190002
SiO2
1.59
Sputtering
Wet Etch
1.64
900C_3hr
1,580.22998
TE
3.8
56.419998
25.389999
43.02
4.127
0.551
71.339996
69.18
0.329
1.598
0.881
BATCH_15
Measurement
OTDR
0.092
1.764
331.049988
SiO2
4.67
PECVD
ICP
4.58
900C_1hr
1,592.550049
TE
-6.07
54.880001
198.960007
30.280001
14.089
4.24
60.709999
62.639999
0.076
1.866
0.888
BATCH_10
Measurement
microring_Q
0.148
0.941
222.940002
SiO2
4.09
Sputtering
RIE
1.26
900C_3hr
1,546.040039
TM
8.01
26.58
26.280001
29.379999
3.041
0.494
68.589996
71.879997
0.048
1.624
0.708
BATCH_26
Measurement
ring_resonance
0.095
1.431
567.200012
SiO2
1.44
Sputtering
Wet Etch
2.61
900C_1hr
1,506.560059
TM
-3.34
70.480003
98.540001
47.279999
23.93
4.863
88.669998
72.349998
0.323
1.702
0.766
BATCH_25
Synthetic
cut-back
0.161
1.962
474.850006
Polymer
1.51
Sputtering
RIE
4.63
900C_3hr
1,524.030029
TM
-0.47
37.830002
85.129997
33.52
10.516
2.837
89.879997
69.349998
0.208
1.574
0.948
BATCH_4
Measurement
cut-back
0.013
1.244
215.119995
Polymer
2.96
LPCVD
ICP
2.16
No_Anneal
1,559.430054
TE
-3.03
33.009998
43.09
1.86
1.328
2.211
67.150002
42.43
0.461
1.58
0.786
BATCH_50
Synthetic
microring_Q
0.16
0.6
583.530029
Polymer
4.39
LPCVD
RIE
3.23
900C_1hr
1,508.400024
TE
1.35
29.200001
113.459999
31.18
10.079
2.831
88.32
76.040001
0.49
1.614
0.877
BATCH_13
Synthetic
cut-back
0.113
1.029
206.070007
Polymer
2.18
LPCVD
Wet Etch
4.02
900C_1hr
1,527.199951
TE
8.93
44.759998
157.759995
32.93
6.81
1.604
60.630001
52.290001
0.183
1.982
0.764
BATCH_38
Synthetic
cut-back
0.183
1.164
246.720001
Air
2.24
PECVD
Wet Etch
0.76
900C_1hr
1,539.839966
TM
-7.03
26.91
123.82
34.68
11.309
3.102
76.489998
72.809998
0.225
1.61
0.811
BATCH_6
Synthetic
OTDR
0.059
1.34
428.190002
SiO2
4.92
Sputtering
RIE
3.68
900C_1hr
1,544.339966
TM
6.91
52.330002
150.190002
36.27
9.506
2.309
77.110001
89.989998
0.044
1.764
0.859
BATCH_30
Synthetic
OTDR
0.163
1.441
388.019989
SiO2
1.63
LPCVD
Wet Etch
2.01
900C_1hr
1,515.219971
TM
1.24
41.349998
26.26
34.5
17.332001
4.513
57.310001
56.5
0.166
1.961
0.78
BATCH_46
Synthetic
OTDR
0.195
0.793
498.899994
SiO2
4.66
LPCVD
RIE
2.34
900C_3hr
1,541.02002
TE
3.42
25.16
118
23.290001
10.112
4.094
87.300003
74.480003
0.399
1.551
0.927
BATCH_23
Measurement
ring_resonance
0.088
0.839
503.690002
SiO2
4.14
PECVD
Wet Etch
4.44
900C_3hr
1,579.640015
TM
-2.9
77.550003
127.790001
20.17
8.274
3.7
51.02
75.849998
0.37
1.662
0.833
BATCH_26
Measurement
ring_resonance
0.047
1.06
297.730011
Polymer
2.53
Sputtering
RIE
2.62
900C_3hr
1,504.660034
TM
-6.44
24.860001
74.769997
10.18
5.673
4.258
56.110001
47.509998
0.26
1.617
0.91
BATCH_33
Synthetic
OTDR
0.185
0.942
474.630005
Polymer
3.19
PECVD
ICP
4.35
900C_3hr
1,570.51001
TM
6.91
33.169998
77.959999
20.280001
4.792
1.974
46.700001
51.939999
0.464
1.977
0.832
BATCH_11
Measurement
microring_Q
0.028
1.542
538.640015
Air
4.49
PECVD
ICP
2.71
1000C_1hr
1,566.5
TM
1.85
52.169998
37.709999
2.77
2.373
4.857
85.580002
58.860001
0.341
1.801
0.845
BATCH_14
Synthetic
cut-back
0.081
0.634
433.570007
Polymer
4.21
Sputtering
Wet Etch
3.58
900C_3hr
1,534.560059
TE
-6.9
50.689999
115.099998
25.190001
9.514
3.536
50.599998
69.470001
0.13
1.997
0.897
BATCH_26
Measurement
cut-back
0.191
1.374
333.179993
SiO2
2.25
Sputtering
RIE
0.57
900C_1hr
1,580.859985
TM
-4.55
62.900002
67.25
46.5
16.466999
3.144
40.990002
84.050003
0.373
1.896
0.95
BATCH_12
Measurement
cut-back
0.134
1.992
451.309998
Air
4.84
Sputtering
ICP
1.63
No_Anneal
1,517.5
TM
-8.41
70.360001
102.800003
22.030001
3.178
0.751
43.759998
45.16
0.225
1.602
0.845
BATCH_38
Synthetic
cut-back
0.042
1.845
558.950012
Air
4.48
Sputtering
Wet Etch
0.94
1000C_1hr
1,540.839966
TM
5.43
34.849998
198.399994
19.549999
6.611
3.089
42.310001
58.639999
0.254
1.985
0.754
BATCH_23
Synthetic
cut-back
0.172
1.81
480.589996
Air
3.04
LPCVD
Wet Etch
4.39
No_Anneal
1,524.400024
TM
8.86
57.02
44.139999
28.01
1.795
0.376
57.639999
62.41
0.304
1.907
0.736
BATCH_16
Measurement
microring_Q
0.063
1.885
308.179993
Air
3.74
LPCVD
RIE
0.62
900C_1hr
1,597.910034
TM
1.77
74.440002
101.360001
49.290001
5.944
1.048
57.68
47.68
0.171
1.919
0.916
BATCH_18
Synthetic
cut-back
0.158
1.929
563.369995
Polymer
1.81
LPCVD
ICP
1.63
No_Anneal
1,551.380005
TE
-5.96
72.650002
183.389999
28.780001
10.791
3.49
74.620003
44.5
0.011
1.756
0.837
BATCH_11
Synthetic
microring_Q
0.103
1.342
275.209991
SiO2
3.43
Sputtering
Wet Etch
2.68
1000C_1hr
1,556.97998
TE
-6.29
76.870003
188.860001
28.76
3.048
0.495
78.589996
73.410004
0.207
1.762
0.795
BATCH_39
Synthetic
ring_resonance
0.173
0.667
259.459991
Air
3.67
Sputtering
RIE
4.41
No_Anneal
1,562.709961
TM
-3.12
57.25
152.350006
9.51
1.825
0.523
53.720001
44.040001
0.104
1.515
0.714
BATCH_4
Synthetic
microring_Q
0.024
1.845
407.059998
SiO2
4.97
Sputtering
RIE
2.6
1000C_1hr
1,587.209961
TE
3.66
35.439999
139.300003
21.92
2.171
0.66
62.810001
77.980003
0.202
1.79
0.813
BATCH_21
Synthetic
OTDR
0.129
1.708
462.279999
Air
1.11
LPCVD
RIE
1.36
No_Anneal
1,545.420044
TM
-1.6
52.68
153.669998
7.66
2.419
0.8
43.860001
51.73
0.043
1.552
0.764
BATCH_25
Synthetic
ring_resonance
0.021
1.633
521.799988
Polymer
1.35
LPCVD
Wet Etch
3
1000C_1hr
1,526.349976
TE
3.8
44.400002
39.16
48.610001
19.309
3.691
69.639999
54.02
0.152
1.958
0.912
BATCH_24
Measurement
ring_resonance
0.095
1.959
211.339996
Polymer
3.21
PECVD
ICP
2.04
900C_1hr
1,583.880005
TM
9.7
76.949997
20.51
5.68
4.073
4.358
51.279999
82.360001
0.179
1.891
0.782
BATCH_9
Measurement
cut-back
0.078
1.202
396.899994
SiO2
2.69
LPCVD
ICP
2.82
No_Anneal
1,579.810059
TM
-9.21
64.139999
78.879997
5.6
3.108
4.191
41.130001
69.07
0.329
1.686
0.706
BATCH_21
Synthetic
ring_resonance
0.11
1.316
557.210022
SiO2
4.21
LPCVD
Wet Etch
2.96
No_Anneal
1,588.140015
TE
-5.06
54.639999
199.649994
44.02
6.139
1.201
57.18
50.529999
0.303
1.747
0.869
BATCH_50
Measurement
ring_resonance
0.014
0.529
584.76001
Air
3.24
LPCVD
ICP
2.14
900C_3hr
1,594.160034
TM
-5.32
61.130001
131
6.99
1.103
0.705
52.93
60.369999
0.274
1.81
0.727
BATCH_35
Synthetic
OTDR
0.142
1.168
575.690002
Polymer
3.3
PECVD
RIE
4.56
No_Anneal
1,533.050049
TE
-3.38
30.32
151.289993
30.77
2.225
0.22
64.739998
78.739998
0.254
1.805
0.939
BATCH_1
Synthetic
microring_Q
0.159